Bismaleimide/Phenolic/Epoxy Ternary Resin System for Molding Compounds in High-Temperature Electronic Packaging Applications | Industrial & Engineering Chemistry Research
Preparation and properties of bismaleimide resins modified with hydrogen silsesquioxane and dipropargyl ether and their composites | Polymer Journal
Bismaleimide/Phenolic/Epoxy Ternary Resin System for Molding Compounds in High-Temperature Electronic Packaging Applications | Industrial & Engineering Chemistry Research
Polymers | Free Full-Text | Epoxy-Modified Bismaleimide Structural Adhesive Film Toughened Synergistically with PEK-C and Core–Shell Polymers for Bonding CFRP
A novel high performance bismaleimide/diallyl bisphenol A (BMI/DBA)–epoxy interpenetrating network resin for rigid riser application - RSC Advances (RSC Publishing) DOI:10.1039/C5RA14474D
Materials | Free Full-Text | Enhancement of Thermal and Mechanical Properties of Bismaleimide Using a Graphene Oxide Modified by Epoxy Silane
Preparation and properties of bismaleimide resins modified with hydrogen silsesquioxane and dipropargyl ether and their composites | Polymer Journal
Polymers | Free Full-Text | Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched Structures
Bismaleimide/Phenolic/Epoxy Ternary Resin System for Molding Compounds in High-Temperature Electronic Packaging Applications | Industrial & Engineering Chemistry Research
Bismaleimide/Phenolic/Epoxy Ternary Resin System for Molding Compounds in High-Temperature Electronic Packaging Applications | Industrial & Engineering Chemistry Research
Beyond Epoxy: High Performance Thermosets Part Two - Bismaleimide Cure Chemistry - Polymer Innovation Blog